- 中文
- English
- Español
Can you tell the difference between grinding and grinding?
2023-06-08 20:22:33
Click：
“
The division rule of brushing and grinding is to observe the thickest area of the waist from the side under the condition of 10 times magnification. According to the severity of brushing and grinding, it can be divided into four levels: none, medium, obvious and serious.
”
In the cutting and grinding process of round diamonds, in order to minimize the loss of carat weight of round diamonds and eliminate the flaws near the girdle, the processing method of changing the inclination angle of the upper and lower girdle facets is adopted, and the method of reducing the inclination angle of the upper and lower girdle facets is adopted. It is called painting, and the method of increasing the inclination angle of the upper and lower waist facets is called digging out.
Brush grinding refers to the girdle thickness between the connecting points of the upper girdle facets and the lower girdle facets (A, B) of round brilliant cut diamonds, which is smaller than the girdle thickness between the kite face and the pavilion main facets (C, D place) phenomenon.
Polishing refers to the phenomenon that the girdle thickness (A, B) between the connecting point of the upper girdle facet and the lower girdle facet of the diamond is greater than the girdle thickness (C, D) between the kite face and the pavilion main facet .
The division rule of brushing and grinding is to observe the thickest area of the waist from the side under the condition of 10 times magnification. According to the severity of brushing and grinding, it can be divided into four levels: none, medium, obvious and serious. Various degrees and combinations of brushing and chipping affect the ratio grade, with severe brushing and chipping reducing the ratio grade by one step.
Prev : Have you noticed the size of the culet of the loose diamond?
Next : The price all falling, but lab diamonds are taking the opportunity to rise?
Your liking encourage us persist
YouArticle
已有16人推荐
-
CVD Single-Crystal Diamonds: An Analysis of the Complete Processing Workflow from Gas-Phase Deposition to Finished Diamond Chips
MPCVD (Microwave Plasma Chemical Vapor Deposition) technology is currently the core process for producing high-quality single-crystal diamond s. Thanks to its advantages of low defect rates, high purity, and controllable large dimensions, it is widely used in fields such as semiconductor heat dissipation, precision optics, and high-end sensors. The final quality of single-crystal diamond s depends on comprehensive process control throughout the entire workflow—from vapor deposition growth to pos
-
Single-Crystal or Polycrystalline Diamond — Which Has Greater Potential?
As diamond continues to enter industries such as semiconductors, thermal management, optics, high-power electronics, and precision machining, the requirements for diamond materials are also evolving.
-
Diamond Polishing and Grinding Processes: Core Challenges and Industry Hurdles
Diamond is often hailed as the “ultimate material” – ranking 10 on the Mohs hardness scale, boasting an ultra‑high thermal conductivity (~2,200 W/(m·K)), excellent chemical stability, and broad optical transparency. These properties make it irreplaceable in cutting‑edge applications such as semiconductor heat dissipation, high‑end optics, and quantum chips. Yet the paradox of “good materials are hard to process” is nowhere more evident than in diamond. From rough grinding for planarization to at
-
Single-Crystal vs Polycrystalline CVD Diamond: Process Difference Lies in Growth Logic, Not Equipment
The process difference between single crystal and polycrystalline CVD diamond lies not in equipment, but in growth logic. Single crystal and polycrystalline CVD diamond are two functional new materials with completely independent growth mechanisms, lattice structures and performance systems. Their process logic, product features and application boundaries diverge fundamentally from the very start of deposition and growth. Comparing or selecting materials without considering their underlying crys
