曼尼森吉他定制

  • 提交

  • Security Code
    Refresh the code
    Cancel
    Confirm
图片展示
图片展示
  • 中文
  • English
  • Español

High Light Intelligence Technology invites you to visit the 6th Shenzhen International Semiconductor Exhibition from June 26th to 28th

2024-06-06 09:45:17

Click:


Invitation Card






According to the new "Power Silicon Carbide - Equipment Market and Technology Trend Analysis Report" recently released by Yole Group, the silicon carbide market is growing rapidly and attracting a lot of investment. Capital expenditures in the silicon carbide market will peak in 2026, and silicon carbide device revenues may exceed overall capital expenditures in 2027. This trend reflects the strong growth momentum and continued investment demand in the silicon carbide market.




On June 26-27, the 5th Third Generation Semiconductor Conference was held in Hall 6 of Shenzhen International Convention and Exhibition Center (Bao'an New Hall), relying on the 6th SEMI-e Shenzhen International Semiconductor Exhibition (60,000 square meters, 800+ exhibitors, and an estimated audience of 60,000+). At that time, industry authorities, leading companies, research institutions and elites will gather together to explore the third-generation semiconductor industry landscape, cutting-edge technologies and market trends, and share the latest research results and industry dynamics. High Light Intelligence Technology is also fortunate to participate in the industry feast.




01

Forum agenda and guest speakers


Theme 1:
Sharing of advanced packaging and testing technologies and processes
Date 06.26 10:00 - 12:00



Swipe up to read


Host:
Inner Mongolia Jinghang Special Carbon Technology Co., Ltd.
Mr. Li Xueguang
Time: June 26

Belgian wafer foundry-BelGaN
Dr. Zhou Zhenhong CEO
Speech time: 10:00-10:20
Speech topic: "Global SiC and GaN industrial ecological competition pattern and future development"

Innoscience (Shenzhen) Semiconductor Co., Ltd.
Xie Wenbin Senior Chief Engineer of Product Application
Speech time: 10:20-10:40
Speech topic: "Key factors for large-scale application of gallium nitride"

Zhuhai Ga Future Technology Co., Ltd.
Zhang Dajiang R&D Director
Speech time: 10:40-11:00
Speech topic: "The future has come-the development of gallium nitride devices in high-power applications"

Shaanxi Yuteng Electronic Technology Co., Ltd.
Lin Liteng General Manager
Speech time: 11:00-11:20
Speech topic: "Introduction to gallium nitride epitaxy"

Shandong Jingga Semiconductor Co., Ltd.
Wang Shouzhi General Manager
Speech time: 11:20-11:40
Speech topic: "Gallium Nitride Crystal Growth and Processing Research"

Fuzhou Gagu Semiconductor Co., Ltd.
Dr. Liang Hu General Manager/CTO/Chief Scientist
Speech time: 11:40-12:00
Speech topic: "Gallium Nitride Power Electronics Application and Epitaxial Technology Introduction"



Theme 2:
Analysis of SiC technology status and market trends
Date 06.26 13:40 - 16:20



Swipe up to read



Beijing Tianke Heda Semiconductor Co., Ltd.
Guo Yu, Technical Director
Speech time: 13:40-14:00
Speech topic: "Progress and challenges of high-quality 4H-SiC substrates and epitaxial materials"

Shanxi Shuoke Crystal Co., Ltd.
Ma Kangfu, Assistant General Manager
Speech time: 14:00-14:20
Speech topic: "The current status and thinking of the development of large-size silicon carbide single crystal substrates"

Harbin Keyou Semiconductor Industry Equipment and Technology Research Institute Co., Ltd.
Dr. Zhang Shengtao, R&D Technical Director
Speech time: 14:20-14:40
Speech topic: "Progress in the industrialization of Keyou's 8-inch silicon carbide substrates"

Jiangsu Jixin Advanced Materials Co., Ltd.
Guan Chunyang, Director and Executive President
Speech time: 14:40-15:00
Speech topic: "Research on the development trend of SiC substrate sheet size and the direction of significant cost reduction at this stage"

AIXTRON
Fang Ziwen General Manager
Speech time: 15:00-15:20
Speech topic: "Compound semiconductor epitaxy mass production solutions"

Hebei Puxing Electronic Technology Co., Ltd.
Zhang Yongqiang Product Director
Speech time: 15:20-15:40
Speech topic: "Large diameter silicon carbide epitaxy technology and progress"

Dalian Chuangrui Spectroscopy Technology Co., Ltd.
Chen Yuzhong CEO
Speech time: 15:40-16:00
Speech topic: "Defect detection of Sic substrate and epitaxial wafer"



Theme 3:
The core of the new energy industry: the current status and analysis of my country's automotive power device market
Date 06.27 10:00 - 11:00



Swipe up to read



Host:
Guangzhou Yuesheng Semiconductor Equipment Co., Ltd.
Li Jinghui, female
Host time: June 27

Navitas Semiconductor
Zhu Jin, Senior Technical Marketing Manager
Speech time: 10:00-10:20
Speech topic: "Navitas Semiconductor GaN & SiC Opens a New Chapter in Vehicle Power Design"

Guangdong Zhineng Technology Co., Ltd.
Co-founder Dr. Wang Lezhi
Speech time: 10:40-11:00
Speech topic: Application defines devices, market drives progress, GaN is born for innovation

Shenzhen Basic Semiconductor Co., Ltd.
Cai Xiongfei, Deputy General Manager
Speech time: 11:00-11:00
Speech topic: "Progress in Automotive-grade Power Semiconductors"



Theme 4:
Explore the preparation of new semiconductor (GaN/SiC) materials
Date 06.27 14:00 - 15:40



Swipe up to read



Qingdao Gaoce Technology Co., Ltd.
Yu Yapeng, Industry Solution Manager
Speech Time: 14:00-14:20
Speech Topic: "Application and Development of Diamond Wire Cutting Technology in the Semiconductor Industry"

China Electronics Technology Group Corporation 45th Research Institute
Song Wenchao, Deputy Director of Semiconductor Cleaning Equipment Division
Speech Time: 14:20-14:40
Speech Topic: "Research on Domestic Semiconductor Wet Process Equipment"

Beijing North Huachuang Microelectronics Equipment Co., Ltd.
Compound Semiconductor Industry Development Department Deputy General Manager Lv Chunxue
Speech Time: 14:40-15:00
Speech Topic: Demand-led, technological innovation, building a new ecology of China's silicon carbide industry

Beijing Jingyi Jingwei Technology Co., Ltd.
Cai Changyi, Senior Director of R&D Laboratory
Speech Time: 15:00-15:20
Speech Topic: "ECMP Solution for Silicon Carbide Substrate"

Zhejiang Bolai Narun Electronic Materials Co., Ltd.
Zhang Zefang, Chairman
Speech Time: 15:20-15:40
Speech topic: "Total solution for silicon carbide CMP materials"

Dongguan Keshi Technology Co., Ltd.
Mei Lingliang, General Manager
Speech time: 15:40-16:00
Speech topic: Application of water-guided laser in micro-precision processing of semiconductor materials









02

Sneak peek at the conference list




Swipe up to read



The list is constantly being updated...





Product and Service

海光







In this forum, High Light Intelligence Technology will serve as an exhibitor and display our series of products such aIndustrial and semiconductor single crystal and polycrystalline diamond products developed through MPCVD technology at the exhibition site. These products not only represent our latest technological achievements, but also demonstrate our ultimate pursuit of material quality and strict control of process details.

















Time:2024/06/26-28



Location:

Shenzhen World Exhibition & Convention Center (Hall 4/6/8)


深圳国际会展中心
广东省深圳市宝安区福海街道展城路1号



Booth:8L48





~
Looking forward to your joining and seeing you on site
Get inspired with us

Free scanning code to visit the exhibition:





0
High Light Intelligence Technology invites you to visit the 6th Shenzhen International Semiconductor Exhibition from June 26th to 28th
Long by picture save/share

HOME                PRODUCTS                BRAND                 NEWS                 CONTACT


图片展示
SEACH

© 2022   Foshan High Light Intelligence Technology Co., Ltd.   All rights reserved

Technical support: fsyunlum

© 2022   Foshan High Light Intelligence Technology Co., Ltd.   All rights reserved

添加微信好友,详细了解产品
使用企业微信
“扫一扫”加入群聊
复制成功
添加微信好友,详细了解产品
我知道了