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Japan and South Korea join forces to develop diamond semiconductors

2025-04-25 09:03:20

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Recently, the Korea Electric Research Institute (KERI) and a consulting firm in Japan have advanced the research and development of diamond power semiconductors. In terms of division of labor, Orbray is responsible for chip synthesis processing, while KERI focuses on device design and application research. Orbray has global leading experience in wafer fabrication and synthesis technology, while KERI has advanced experimental platforms and industrialization capabilities, with deep technological a


Recently, the Korea Electric Research Institute (KERI) and a consulting firm in Japan have advanced the research and development of diamond power semiconductors. In terms of division of labor, Orbray is responsible for chip synthesis processing, while KERI focuses on device design and application research. Orbray has global leading experience in wafer fabrication and synthesis technology, while KERI has advanced experimental platforms and industrialization capabilities, with deep technological accumulation. The government of South Gyeongsang Province will also provide administrative and financial support to ensure the research and development environment for international teams. Through the cooperation of 'government industry research', support technology iteration and verification.


The performance of traditional materials approaches the theoretical limit, and the new generation of wide bandgap semiconductor materials represented by diamond has become the focus of global technological competition. Diamond has an extremely wide bandgap (about 5.5 eV), with breakdown electric field strength, thermal conductivity, and carrier mobility far exceeding those of silicon (Si), gallium nitride (GaN), and silicon carbide (SiC). Its theoretical performance supports higher operating voltages, current densities, and temperature environments, and it is known as the 'ultimate power semiconductor material'. The theoretical breakdown voltage of its power device is three times higher than that of silicon carbide, and its thermal conductivity is 5 to 10 times higher. After large-scale application, it will revolutionize high-end equipment manufacturing fields such as power electronics and aerospace.


According to Virtuemarket, the global diamond semiconductor substrate market is expected to be worth $151 million in 2023 and $342 million by the end of 2030, with a compound annual growth rate of 12.3% from 2024 to 2030. The Asia Pacific region is expected to dominate the market driven by the growing demand from the electronics and semiconductor industries in countries such as China, Japan, and South Korea, accounting for over 40% of global revenue share in 2023.


South Korea collaborates with Orbray to break the dependence on the silicon route and build a diamond semiconductor full chain system. Orbray has partnered with Element Six to produce high-quality single-crystal diamond wafers. However, the industrialization of diamond power semiconductors faces high technological barriers, material synthesis bottlenecks, device process and reliability challenges, and cost issues. At the material level, breakthroughs are needed in large size, low defect density, and doping uniformity; There are many technological gaps in the device aspect that require long-term testing and verification; The high cost makes it difficult to achieve cost-effectiveness advantages in conventional industrial applications.


The diamond power semiconductor stage is mainly focused on special applications, with a lag in civilian use. The breakthrough lies in special equipment with high power density and extreme environments, such as high-frequency and high-voltage components in national defense and aerospace systems. In the future, high-end civilian scenarios such as upgrading high-voltage platforms for electric vehicles will also provide opportunities for it. However, industrialization requires mature materials preparation, device reliability, packaging processes, and other aspects. Although this cooperation between South Korea has filled the gaps, industrialization still requires long-term interdisciplinary verification and capital investment, facing many challenges.

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Japan and South Korea join forces to develop diamond semiconductors
Recently, the Korea Electric Research Institute (KERI) and a consulting firm in Japan have advanced the research and development of diamond power semiconductors. In terms of division of labor, Orbray is responsible for chip synthesis processing, while KERI focuses on device design and application research. Orbray has global leading experience in wafer fabrication and synthesis technology, while KERI has advanced experimental platforms and industrialization capabilities, with deep technological a
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